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  • At least binary hit information
  • Material Budget → minimize multiple scattering
    • thinned chip to 50um → MAPS/CMOS
    • also up to 150 at 5 GeV, even up to 350 um is fine, if resolution is ~3 um
    • towards lower energies (higher rates) e.g. a hybrid w/ 100 um sensor, 50 um ASIC )is fint
    • 50um is not a hard requirement!
  • Detection efficiency (for GeV electrons) >99%
  • Hit resolution: Linear Collider Vertex sensor requirement < 3 um single point resolution
    • → track resolution at DUT of same order
    • →  < 5.5 um single point of t'scope sensor (hard limit)
    • → Achieved by either small pitch binary or larger pitch + ToT charge weighting
  • Time resolution: <5 us ("Alpide" limit)

  • Read-Out:
    • no rolling shutter
    • frame based (global shutter)
  • Active Area
    • 2 x 2 cm
  • Availability after production: ~100 sensors
  • Radiation hardness: TODO (could be considered a NTH for longevity @ CERN)

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