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  • CLICpix + 50 um sensor, 65 nm, 25 um pitch, ~8 um spatial res for 50 um thin sensor, caveat: hybrid
  • C3PD + CLICpix2 (glued), 65 nm, 25 um pitch, ~9 um spatial res, improvement expected for HR sample, 10 ns time res from CLICpix2, caveat: hybrid
  • ATLASpix HV-CMOS, 130 x 40 pitch ...
  • HRCMOS Investigator, 180 nm, 28 um pitch, down to 5 us spatial res, noise ?!, time res FRONT-END ONLY ~5 ns,
  • Cracow SOI, 200 nm, down to 30 x 30 pitch, below 2 um spatial res!caveat: rolling shutter
  • CLIPS SOI technology?, 20 pitch, target < 3 um spatial res, below 10 ns time res, thinning to 75-100 was already planned, r/o ??

Details will be added after CLIC Collaboration Meeting end of August

DEPFETs

task owner: nn

availability poor, slow production and slow r/o, costly → Survey not really needed ?!

  • e.g. Belle II version


Moench

task owner: nn

 ... is a hybrid → Check feasibility to make thin version ( = "50 um sensor + 50 um ASIC)


FPCCD (Vertex detector for ILC)

task owner: nn


Monolythic SOI

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