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Panel
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  1. Courtyard is needed on Layer 15, in nominal Footprints the distance between copper and Line shall be at least 0.2mm. Line width is 0.05mm. A cross shall be located in the middle of the component.
  2. The reference point must be at the center of a component. At THT-Header the reference point is located at PIN 1.
  3. On Layer 13 11 shall be the Componentoutline with a Indicator of Pin1 and
  4. On Layer 13 shall be a 3D-Body
  5. On Layer 30 shall be the Componentoutline with the text .Designator
  6. On Layer 31 shall be the Componentoutline with the text .Comment
  7. Top Overlay min line width is 0.12mm, min distance copper to overlay 0.12mm
  8. Zero Orientation shall follow IEC 61188-7 “Level B” (IPC 7351C - Level B) with Pin 1 in Lower Left Corner
  9. One example:
  10. Pads should be rounded rectangle, except thermal pads under BTC's they must be rectangle
  11. Thermal Pads under BTC's shall have a Paste Pattern with around 50% paste in respect to the complete pad
  12. This pattern shall also be defined with a corresponding solder mask (see example below)
  13. Follow Footprint naming convention

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