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Mimosa26

  • Type
    • AMS 350 nm CMOS technology
    • Epitaxial Layer: different families 10, 15, 20 um, high resistivity (about 400 Ωcm)
  • Dimensions:
    • Pixel pitch: 18.4 μm × 18.4 μm
    • Active area: 21.2×10.6 mm 1152 columns and 576 lines/rows
    • Thinned to 50um
  • Read-out
    • Binary
    • integration time equals 115.2 μs
    • Continous Rolling shutter: line by line
    • Dead time free
  • Features:
    • Zero-Supression
    • Buffer: states, sections, ...
    • Deactivate (hot) columns
  • Characterisation:
    • "average intrinsic resolution of the MIMOSA 26 sensors at 6 GeV and threshold ξ n=6 results to
      σM26=(3.24 ± 0.09)μm"
    • "For dz=dz DUT=20 mm at 5 GeV beam energy the track resolution at the DUT is σt(zDUT) = (1.83 ± 0.03)μm"

Alpide

task owner: Yi, Jan

  • Type:
    • TowerJazz 180nm CMOS Imaging sensor
    • 25um epitaxial layer
    • Full CMOS within pixel matrix
  • Key concepts:
    • In-pixel amplification
    • In-pixel discrimination
    • In-pixel 3-level event memory
    • In-matrix zero-suppression
  • Dimensions: 
    • Pixel pitch: 29um x 27um
    • Active area: 30mm x 13.8mm (plus 1.2mm periphery) = 1024 x 512 pixels
    • Thinned to 50um (= 0.05% x/X0)
  • Read-Out:
    • Binary
    • Event-time resolution 2-4us (charge collection time only 1-30ns, but not exploited)
    • Global Shutter (strobe = shutter behind discriminator)
      • triggered acquisition (up to ~6MHz/cm^2 particle hit rate)
      • continuous (integration time from 1us to infinity)
    • 1.2 Gbit/s serial link, up to 5m cable
  • Features:
    • optionally working with reverse bias voltage
    • low power consumption 40mW/cm^2 → no cooling needed
  • Characterisation (threshold 160e-)
    • Detection Efficiency: > 99%
    • Fake-Hit-Rate: 10^-11 /pixel/event
    • Averaged Cluster Size 
    • ALPIDE telescope = 7 planes, middle plane as DUT, distance 2cm:
      Simulated track resolution at DUT 2-3um with 6GeV/c pions

CLIC developments

task owner: Hendrik

  • CLICpix + 50 um sensor, 65 nm, 25 um pitch, ~8 um spatial res for 50 um thin sensor, caveat: hybrid
  • C3PD + CLICpix2 (glued), 65 nm, 25 um pitch, ~9 um spatial res, improvement expected for HR sample, 10 ns time res from CLICpix2, caveat: hybrid
  • ATLASpix HV-CMOS, 130 x 40 pitch ...
  • HRCMOS Investigator, 180 nm, 28 um pitch, down to 5 us spatial res, noise ?!, time res FRONT-END ONLY ~5 ns,
  • Cracow SOI, 200 nm, down to 30 x 30 pitch, below 2 um spatial res!caveat: rolling shutter
  • CLIPS SOI technology?, 20 pitch, target < 3 um spatial res, below 10 ns time res, thinning to 75-100 was already planned, r/o ??

Details will be added after CLIC Collaboration Meeting end of August

DEPFETs

task owner: nn

availability poor, slow production and slow r/o, costly → Survey not really needed ?!

  • e.g. Belle II version

Moench

task owner: nn

 ... is a hybrid → Check feasibility to make thin version ( = "50 um sensor + 50 um ASIC)

FPCCD (Vertex detector for ILC)

task owner: nn

Monolythic SOI

task owner: nn

(CLIC SOI covered by Hendrik)

Malta

LF2

LGAD/iLGAD

hybrid

3D

hybrid

Gigatracker

task owner: nn

https://indico.cern.ch/event/781403/contributions/3314640/attachments/1821558/2979606/perrin-terrin_2019-04-01.pdf


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