Problem

Many Footprints in Altium are named without any convention.

Solution

Here is a footprint naming convention for use in Altium. 

Naming Convention Notes

  • The first 3 – 7 characters in the land pattern name describe the component family.
  • All dimensions are in Metric Units
  • All dimensions are nominal except height is maximum
  • If there is no pin quantity in the Land Pattern Name it is assumed that the pin quantity is 2
  • All numeric values are two places before and after the decimal point and “remove” leading Zeros
  • All Chip Component Body Sizes are one place to each side of the decimal point
  • Pitch Values are two places to the right & left of decimal point with no leading Zeros but include trailing zeros
  • Thermal Tabs are included in the Pin Quantity

Specific characters are reserved for use in the naming convention to denote or separate certain fields:

  • P : Prefixes pin pitch. For example, P80 specifies a 0.80 mm pitch between terminations.
  • W = Maximum Lead Width (or Component Lead Diameter)
  • L : Prefixes nominal lead dimensions
  • D = Body Diameter for round component body
  • H = Height for vertically mounted components
  • R = Number of Rows for connectors
  • T : Prefixes thermal tab dimensions
  • X : Dimension separator. For example, 0.80 mm by 1.50 mm is denoted 80X150
  • C, N : Denote Collapsing and Non-collapsing balls respectively when specifying a BGA land pattern
  • _ : Underscore is a field separator between pin quantity and/or pin pitch and the package body dimensions
  • - : Dash is a field separator between pin quantity in hidden and deleted pin components
  • + : Plus denotes "in addition to". The plus "+" symbol does not actually appear in the land pattern name but is only used to assist the user in reading the Tables.

Each land pattern in IPC-7351 is specified by a unique name that must convey the package family type, pin quantity, pin pitch, body length and width dimensions, terminal lead span, terminal lead length and width and thermal pad dimensions whenever applicable. Other fields in a land pattern name are optional and are discussed below.

Additional and Optional Fields:


The suffix letters ‘‘L’’, ‘‘M’’, and ‘‘N’’ are used to signify when the land protrusion is at their minimum (least), maximum (most), or median (nominal) protrusion and appear as the last character. The 3 Density Levels are defined as follows:
M = Maximum (Most) Material Condition (Density Level A)
N = Median (Nominal) Material Condition (Density Level B)
L = Minimum (Least) Material Condition (Density Level C)

If no Density Level suffix is provided, then the land pattern either follows the component manufacturer's recommended pattern or a custom land pattern for use with multiple component manufacturer’s packages in the same component family.

Additional suffices for JEDEC Standard parts that have several alternate packages are as follows:
AA, AB, AC JEDEC Component Identifier (used primarily on Semiconductor packages).
Additional suffixes for alternate components that do not follow the JEDEC standard are as follows (these are located before the Density Level suffix):
‘‘A’’ – Alternate Component letter is used when component package nominal dimensions are the same for two packages but the package tolerances are different enough to create a unique land pattern to avoid land pattern name duplication.


Ball Grid Array (BGA) packages may require land pattern names that indicate a difference in pitch between balls in the rows vs. balls in the columns. These are often referred to as a “dual pitch BGA”. For example, the BGA land pattern name of BGA48C80X100P6X8_900X1200X120 conveys that the pitch 0.80 mm between columns and 0.100 mm between rows.

Note: In this example, Pin A1 is assumed to be located in the Lower left when viewing the package from the top view. A 90° rotation of the BGA swaps the definition of Rows and Columns. 

A pin order or pin quantity modifier shall be added to the component package type specification to convey reverse pin ordering, hidden pins, or deleted pins.
SOP20R: 20 pin part, Reverse Pin Order
SOT143R: Reverse Pin Order
SOP20-24: 20 pin part in a 24 pin package. The pins are numbered 1 – 24 the hidden pins are skipped over. The schematic symbol displays up to 24 pins.
SOP24-20: 20 pin part in a 24 pin package. The pins are numbered 1 – 20 the deleted pins are removed. The schematic symbol displays 20 pins.

Surface Mount Naming Convention

Ball Grid Array’s ................................................................................. BGA + Pin Qty. + C or N + P Pitch _ Ball Columns X Ball Rows _ Body Length X Width X Height + B Ball Diameter
BGA w/Dual Pitch .................................................... BGA + Pin Qty. + C or N + P Col Pitch X Row Pitch _ Ball Columns X Ball Rows _ Body Length X Width X Height + B Ball Diameter
BGA w/Staggered Pins ..................................................................... BGAS + Pin Qty. + C or N + P Pitch _ Ball Columns X Ball Rows _ Body Length X Width X Height + B Ball Diameter
Capacitors, Chip, Array, Concave ............................................................................................. CAPCAV + Pin Qty. + P Pitch _ + Body Length X Width X Height + L Lead Length X Width
Capacitors, Chip, Array, Flat ..................................................................................................... CAPCAF + Pin Qty. + P Pitch _ + Body Length X Width X Height + L Lead Length X Width
Capacitors, Chip .............................................................................................................................................................................. CAPC + Body Length X Width X Height + L Lead Length
Capacitors, Polarized, Chip ........................................................................................................................................................... CAPPC + Body Length X Width X Height + L Lead Length
Capacitors, Dual Flat No-lead ....................................................................................................................................... CAPDFN + Body Length X Width X Height + L Lead Length X Width
Capacitors, Polarized, Dual Flat No-lead ................................................................................................................... CAPPDFN + Body Length X Width X Height + L Lead Length X Width
Capacitors, Molded .................................................................................................................................................... CAPM + Lead Span X Body Width X Height + L Lead Length X Width
Capacitors, Polarized, Molded ................................................................................................................................. CAPPM + Lead Span X Body Width X Height + L Lead Length X Width
Capacitors, Aluminum Electrolytic .......................................................................................................................................... CAPAE + Base Body Size X Height + L Lead Length X Width
Ceramic Flat Packages ................................................................................................................ CFP + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width
Column Grid Array, Circular Lead ................................................................................. CGA + Pin Qty. P Pitch _ Pin Columns X Pin Rows _ Body Length X Width X Height + L Diameter
Pillar Column Grid Array .............................................................................................. PCGA + Pin Qty. P Pitch _ Pin Columns X Pin Rows _ Body Length X Width X Height + L Diameter
Crystals (2 leads) ............................................................................................................................................................... XTAL + Body Length X Width X Height + L Lead Length X Width
Crystals, Dual Flat No-lead ......................................................................................................................................... XTALDFN + Body Length X Width X Height + L Lead Length X Width
Crystals, Side Concave ............................................................................................................................................................... XTALSC + Body Length X Width X Height + L Lead Length
Diodes, Chip ..................................................................................................................................................................................... DIOC + Body Length X Width X Height + L Lead Length
Diodes, Dual Flat No-lead ............................................................................................................................. DIODFN + Pin Qty. _ Body Length X Width X Height + L Lead Length X Width
Diodes, Molded ............................................................................................................................................................ DIOM + Lead Span X Body Width X Height + L Lead Length X Width
Diodes, Non-polarized, Chip ................................................................................................................................................... DIONC + Lead Span X Body Width X Height + L Lead Length
Diodes, Non-polarized, Dual Flat No-lead .................................................................................................. DIONDFN + Pin Qty. _ Body Length X Width X Height + L Lead Length X Width
Diodes, Non-polarized, Molded ................................................................................................................................. DIONM + Lead Span X Body Width X Height + L Lead Length X Width
Diodes, MELF ...................................................................................................................................................................................... DIOMELF + Body Length + Diameter + L Lead Length
Diodes, Side Concave .................................................................................................................................................................... DIOSC _ Body Length X Width X Height + L Lead Length
Diodes, Side Concave, 4 Pin ........................................................................................................................................ DIOSC4 + P Pitch _ Body Length X Width X Height + L Lead Length
Diodes, Small Outline Flat Lead, 2 Pin...................................................................................................................... SODFL + Lead Span X Body Width X Height + L Lead Length X Width
Diodes, Small Outline Flat Lead, 3 - 6 Pin ...................................................................................... DIOSOFL + Pin Qty. + P Pitch _ + Lead Span X Body Height + L Lead Length X Width
DPAK .................................................................................................... DPAK + Pin Qty. + P Pitch _ Lead Span X Height + L Lead Length X Width + T Thermal Tab Pad Length X Width
Ferrite Bead, Chip ........................................................................................................................................................................ BEADC + Body Length X Width X Height + L Lead Length
Fuses, Chip ..................................................................................................................................................................................... FUSC + Body Length X Width X Height + L Lead Length
Fuses, Dual Flat No-Lead .................................................................................................................................... FUSDFN + Body Length X Width X Height + L Lead Length X Lead Width
Fuses, Molded .................................................................................................................................................... FUSM + Lead Span X Body Width X Height + L Lead Length X Lead Width
Fuses, Side Concave .................................................................................................................................................................... FUSSC + Body Length X Width X Height + L Lead Length
IC, Small Outline Package, Flat Lead ................................................................................................. SOPFL + Pin Qty. + P Pitch _ + Lead Span X Body Height + L Lead Length X Width
Inductors, Chip ................................................................................................................................................................................. INDC + Body Length X Width X Height + L Lead Length
Inductors, Chip, Array, Concave ................................................................................................... INDCAV + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Inductors, Chip, Array, Flat .............................................................................................................INDCAF + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Inductors, Dual Flat No-lead ........................................................................................................................................... INDDFN + Body Length X Width X Height + L Lead Length X Width
Inductors, Molded ......................................................................................................................................................... INDM + Lead Span X Body Width X Height + L Lead Length X Width
Inductors, Precision, Molded ......................................................................................................................................INDPM + Lead Span X Body Width X Height + L Lead Length X Width
Inductors, Side Concave ................................................................................................................................................................ INDSC + Body Length X Width X Height + L Lead Length
Integrated Circuit, Small Outline, Flat Lead, 3 - 6 pin ........................................................................ ICSOFL + Pin Qty. + P Pitch _ + Lead Span X Body Height + L Lead Length X Width
Land Grid Array, Circular Lead .................................................................... LGA + Pin Qty. + C + P Pitch _ Pin Columns X Pin Rows _ Body Length X Width X Height + L Lead Diameter
Land Grid Array, Square Lead ............................................................................ LGA + Pin Qty. + S + P Pitch _ Pin Columns X Pin Rows _ Body Length X Width X Height + L Lead Size
LED’s, Chip ...................................................................................................................................................................................... LEDC + Body Length + Width X Height + L Lead Length
LED’s, Dual Flat No-lead ............................................................................................................................................... LEDDFN + Body Length X Width X Height + L Lead Length X Width
LED’s, Molded ............................................................................................................................................................. LEDM + Lead Span X Body Width X Height + L Lead Length X Width
LED’s, Side Concave .................................................................................................................................................................... LEDSC + Body Length X Width X Height + L Lead Length
LED’s, Side Concave, 4 Pin .........................................................................................................................................LEDSC4 + P Pitch _ Body Length X Width X Height + L Lead Length
Oscillators, Dual Flat No-Lead (4-pin) ........................................................................................................................ OSCDFN4 _ Body Length X Width X Height + L Lead Length X Width
Oscillators, Side Concave .............................................................................................................. OSCSC + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Oscillators, Side Flat ....................................................................................................................... OSCSF + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Oscillators, J-Lead ..................................................................................................................................... OSCJ + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Width
Oscillators, L-Bend Lead ........................................................................................................... OSCL + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width
Oscillators, Corner Concave ...........................................................................................................................................OSCCC + Body Length X Width X Height + L Lead Length X Width
Plastic Leaded Chip Carriers ............................................................................................... PLCC + Pin Qty. + P Pitch _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Width
Plastic Leaded Chip Carrier Sockets Square .................................................................... PLCCS + Pin Qty. + P Pitch _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Width
Pull-back Small Outline No-lead .................................................. PSON + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width + T Thermal Pad Length X Width
Pull-back Quad Flat No-lead ....................................................... PQFN + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width + T Thermal Pad Length X Width
Quad Flat Packages ......................................... QFP + Pin Qty. + P Pitch _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Length X Width + T Thermal Pad Length X Width
Ceramic Quad Flat Packages ............................................................................. CQFP + Pin Qty. + P Pitch _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Length X Width
Quad Flat No-lead .......................................................................... QFN + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width + T Thermal Pad Length X Width
Quad Leadless Ceramic Chip Carriers ................................................................................................ LCC + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Quad Leadless Ceramic Chip Carriers (Pin 1 on Side) ..................................................................... LCCS + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Resistors, Chip .................................................................................................................................................................................. RESC + Body Length X Width X Height + L Lead Width
Resistors, Chip, Array, Concave .................................................................................................. RESCAV + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Resistors, Chip, Array, Convex, E-Version (Even Pin Size) ...................................................... RESCAXE + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Resistors, Chip, Array, Convex, S-Version (Side Pins Diff) ....................................................... RESCAXS + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Resistors, Chip, Array, Flat .......................................................................................................... RESCAF + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Resistors, Dual Flat No-lead ........................................................................................................................ RESDFN + Pin Qty. _ Body Length X Width X Height + L Lead Length X Width
Resistors, MELF ................................................................................................................................................................................... RESMELF + Body Length + Diameter + L Lead Width
Resistors, Molded ........................................................................................................................................................ RESM + Lead Span X Body Width X Height + L Lead Length X Width
Resistors, Side Concave ................................................................................................................................................. RESSC + Body Length X Width X Height + L Lead Length X Width
Small Outline IC, J-Leaded ......................................................................................................................... SOJ + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Width
Small Outline IC, L-Leaded ......................................................................................................................... SOL + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Width
Small Outline Integrated Circuit, (50 mil Pitch SOIC) ................................................................. SOIC + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width
Small Outline Packages ............................................... SOP + Pin Qty. + P Pitch _ Body Length X Lead Span X Body Height + L Lead Length X Width + T Thermal Pad Length X Width
Small Outline No-lead .................................................................... SON + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width + T Thermal Pad Length X Width
Small Outline Diode ....................................................................................................................................................... SOD + Lead Span X Body Width X Height + L Lead Length X Width
SOT143 ............................................................................................................................................................. SOT143- + Pin Qty. + P Pitch _ Lead Span X Body Height + L Lead Length
SOT343 ............................................................................................................................................................. SOT343- + Pin Qty. + P Pitch _ Lead Span X Body Height + L Lead Length
SOT23 ................................................................................................................................................................. SOT23- + Pin Qty. + P Pitch _ Lead Span X Body Height + L Lead Length
SOT223 ............................................................................................................................................................. SOT223- + Pin Qty. + P Pitch _ Lead Span X Body Height + L Lead Length
Thermistors, Chip ........................................................................................................................................................................... THRMC + Body Length + Width X Height + L Lead Width
Transistors, Small Outline, Flat Lead, 3 - 6 pin ...................................................... TRXSOFL + Pin Qty. + P Pitch _ + Lead Span X Body Length X Body Height + L Lead Length X Width
Transistors, Dual Flat No-lead ............................................................................................................. TRXDFN + Pin Qty. _ Body Length X Body Width X Height + L Lead Length X Width
Varistors, Chip ................................................................................................................................................................................... VARC + Body Length X Width X Height + L Lead Width

Through-Hole Naming Convention

The first number in the land pattern name refers to the Lead Spacing or hole to hole location to insert the component lead.
All numbers that follow the Lead Spacing are component dimensions.

A, B & C = the fabrication complexity level as defined in the IPC-2221 and IPC-2222

Capacitors, Non Polarized Axial Diameter Horizontal Mounting ......... CAPAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Example: CAPAD800W52L600D150B (Complexity Level used in this examples is “B”.)
Capacitors, Non Polarized Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50

Capacitors, Non Polarized Axial Rectangular ......... CAPAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Capacitors, Non Polarized Axial Diameter Vertical Mounting ......... CAPADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Capacitors, Non Polarized Axial Rect. Vert. Mtg. ............. CAPARV + Lead Spacing + W Lead Width + L Body Length + T Body Thickness + H Body Height
Capacitors, Non Polarized Radial Diameter ....................................... CAPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height
Capacitors, Non Polarized Radial Rectangular ....... CAPRR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Capacitors, Non Polarized Radial Disk Button ........ CAPRB + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Capacitors, Polarized Axial Diameter Horizontal Mounting ............. CAPPAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Capacitor, Polarized Radial Diameter .............................................. CAPPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height
Diodes, Axial Diameter Horizontal Mounting ....................................... DIOAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Diodes, Axial Diameter Vertical Mounting .........................................DIOADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Dual-In-Line Packages ................................... DIP + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Dual-In-Line Sockets .................................... DIPS + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Headers, Vertical ....... HDRV + Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L Body Length + T Body Thickness + H Component Height
Headers, Right Angle ............... HDRRA + Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L Body Length + T Body Thickness + H Component Height
Inductors, Axial Diameter Horizontal Mounting .................................... INDAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Inductors, Axial Diameter Vertical Mounting ..................................... INDADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Jumpers, Wire ................................................................................................................................................... JUMP + Lead Spacing + W Lead Width
Mounting Holes Plated With Support Pad .......................................................................... MTGP + Pad Size + H Hole Size + Z Inner Layer Pad Size
Mounting Holes Non-Plated With Support Pad ................................................................ MTGNP + Pad Size + H Hole Size + Z Inner Layer Pad Size
Mounting Holes Non-Plated Without Support Pad ..................... MTGNP + Pad Size + H Hole Size + Z Inner Layer Pad Size + K Keep-out Diameter
Mounting Holes Plated with 8 Vias ..................................................................... MTGP + Pad Size + H Hole Size + Z Inner Layer Pad Size + 8 Vias
Pin Grid Array’s ............................. PGA + Pin Qty + P Pitch + C Pin Columns + R Pin Rows + L Body Length X Body Width + H Component Height
Resistors, Axial Diameter Horizontal Mounting ................................... RESAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Resistors, Axial Diameter Vertical Mounting ....................................RESADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Resistors, Axial Rectangular Horizontal Mounting ... RESAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Single-In-Line Packages ................................ SIP + Body Width + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Test Points, Round Land ...................................................................................................................................................................... TP + Lead Width
Test Points, Square Land .................................................................................................................................................................. TPS + Lead Width
Test Points, Top Land Round & Bottom Land Square ..................................................................................................................... TPRS + Lead Width
Wire .................................................................................................................................................................................................... PAD + Wire Width

Naming for Non-conforming Packages

A large number of component packages are unique, nonstandard packages or unique connectors. These component packages do not fit into a standard land pattern name due to their unique features. Therefore, in order to have a single land pattern naming convention that covers every component package in the electronics industry, the land pattern name must be associated with the component manufacturer and their part number or case code as shown below:


ManufacturerNameAbbreviation_ManufacturerPartNumber or
ManufacturerNameAbbreviation_ManufacturerCaseCode


  • All special characters used in the part number will be replaced with a hyphen “-” except periods “.” will be replaced with an underscore “_”.
  • If the component package or connector is unique and has a single manufacturer part number, then Part Number would be used to generate the Land Pattern Name
  • The component is a standard package and is associated with multiple manufacturer part numbers then manufacturer Case Code would be used to generate the Land Pattern Name

Examples:
FOXCONN_JFM38U1A-2PVT-4F
TI_RKG41 
CK_CRD16CM0SB
MOLEX_67503-1020 
MAXIM_L1053-H2 
ABRACON_ABM11
SAMTEC_QTH-060-01-L-D-A
CUI_SJ-3566AN 
AMPHENOL_101-00565-64